An edition of Thermal Stress and Strain in Microelectronics Packaging (2012)

Thermal Stress and Strain in Microelectronics Packaging

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Thermal Stress and Strain in Microelectronics ...
John Lau, John Lau
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Last edited by ImportBot
April 26, 2020 | History
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An edition of Thermal Stress and Strain in Microelectronics Packaging (2012)

Thermal Stress and Strain in Microelectronics Packaging

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Publish Date
Publisher
Springer London, Limited
Language
English

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Edition Availability
Cover of: Thermal Stress and Strain in Microelectronics Packaging
Thermal Stress and Strain in Microelectronics Packaging
Oct 20, 2012, Springer
paperback
Libraries near you: WorldCat
Cover of: Thermal Stress and Strain in Microelectronics Packaging
Thermal Stress and Strain in Microelectronics Packaging
2012, Springer London, Limited
in English
  • Not in Library
Libraries near you: WorldCat
Cover of: Thermal Stress and Strain in Microelectronics Packaging
Thermal Stress and Strain in Microelectronics Packaging
Apr 30, 2012, Springer
paperback
Libraries near you: WorldCat

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Book Details

Classifications

Library of Congress
TK7800-8360

The Physical Object

Pagination
xxiv, 884

ID Numbers

Open Library
OL37243704M
ISBN 13
9781468477672

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April 26, 2020 Created by ImportBot import new book