An edition of Thermal Stress and Strain in Microelectronics Packaging (2012)

Thermal Stress and Strain in Microelectronics Packaging

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Cover of: Thermal Stress and Strain in Microelectronics Packaging by John Lau, John Lau
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Last edited by ImportBot
February 26, 2022 | History
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An edition of Thermal Stress and Strain in Microelectronics Packaging (2012)

Thermal Stress and Strain in Microelectronics Packaging

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Publish Date
Publisher
Springer
Pages
908

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Edition Availability
Cover of: Thermal Stress and Strain in Microelectronics Packaging
Thermal Stress and Strain in Microelectronics Packaging
2012, Springer London, Limited
in English
Cover of: Thermal Stress and Strain in Microelectronics Packaging
Thermal Stress and Strain in Microelectronics Packaging
Oct 20, 2012, Springer
paperback
Cover of: Thermal Stress and Strain in Microelectronics Packaging
Thermal Stress and Strain in Microelectronics Packaging
Apr 30, 2012, Springer
paperback

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Book Details

Classifications

Library of Congress
TK7800-8360

The Physical Object

Format
paperback
Number of pages
908

ID Numbers

Open Library
OL27960144M
ISBN 10
1468477692
ISBN 13
9781468477696

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Download catalog record: RDF / JSON / OPDS | Wikipedia citation
February 26, 2022 Edited by ImportBot import existing book
April 26, 2020 Created by ImportBot Imported from amazon.com record