An edition of Wafer-Level Chip-Scale Packaging
(2014)
Wafer-Level Chip-Scale Packaging
Analog and Power Semiconductor Applications
by Shichun Qu and Liu, Yong
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Electronic packaging| Edition | Availability |
|---|---|
1
Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications
Aug 23, 2016, Springer
paperback
1493954385 9781493954384
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2
Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications
2014, Springer
in English
1493915568 9781493915569
|
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3
Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications
Sep 11, 2014, Springer
paperback
1493915576 9781493915576
|
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|
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4
Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications
2014, Springer
in English
149391555X 9781493915552
|
zzzz
|
Book Details
Edition Notes
Source title: Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications
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| August 24, 2020 | Edited by ImportBot | import existing book |
| April 25, 2020 | Created by ImportBot | import new book |