| Record ID | marc_loc_2016/BooksAll.2016.part21.utf8:120357744:1280 |
| Source | Library of Congress |
| Download Link | /show-records/marc_loc_2016/BooksAll.2016.part21.utf8:120357744:1280?format=raw |
LEADER: 01280cam a2200301 a 4500
001 91201833
003 DLC
005 20040213131547.0
008 911002s1991 nyua b 101 0 eng
010 $a 91201833
020 $a0791807401
040 $aDLC$cDLC$dDLC
050 00 $aTK7870.25$b.H393 1991
082 00 $a621.381/046$220
245 00 $aHeat transfer in electronic equipment, 1991 :$bpresented at the 28th National Heat Transfer Conference, Minneapolis, Minnesota, July 28-31, 1991 /$csponsored by the Heat Transfer Division, ASME ; edited by A. Ortega, D. Agonafer, B.W. Webb.
260 $aNew York, N.Y. :$bAmerican Society of Mechanical Engineers,$cc1991.
300 $av, 143 p. :$bill. ;$c28 cm.
490 1 $aHTD ;$vvol. 171
504 $aIncludes bibliographical references and index.
650 0 $aElectronic apparatus and appliances$xCooling$xCongresses.
650 0 $aHeat$xTransmission$xCongresses.
650 0 $aElectronic packaging$xCooling$xCongresses.
700 1 $aOrtega, A.$q(Alfonso),$d1954-
700 1 $aAgonafer, D.
700 1 $aWebb, B. W.
710 2 $aNational Heat Transfer Conference$n(28th :$d1991 :$cMinneapolis, Minn.)
710 2 $aAmerican Society of Mechanical Engineers.$bHeat Transfer Division.
830 0 $aHTD (Series) ;$vv. 171.