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Last edited by Mek
October 14, 2016 | History
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Chuan Seng Tan

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4 works Add another?

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  • Cover of: Physical Design for 3D Integrated Circuits

    First published in 2015 — 6 editions
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  • Cover of: Advances in 3D Integrated Circuits and Systems

    First published in 2015 — 3 editions
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  • Cover of: Wafer Level 3-D ICs Process Technology

    First published in 2008 — 3 editions
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  • Cover of: 3D Integration for VLSI Systems

    First published in 2016 — 2 editions
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Subjects

Integrated circuits, Design and construction, Electronic circuit design, Electronics, Engineering, Mechanical, Optical materials, Surfaces (Physics), TECHNOLOGY & ENGINEERING, Three-dimensional integrated circuits

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ID Numbers

  • OLID: OL7302387A

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History

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October 14, 2016 Created by Mek Added new book.