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Last edited anonymously
April 29, 2008 | History
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C.P. Wong

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4 works Add another?

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  • Cover of: Electronic Packaging: Design, Materials, Process, and Reliability

    First published in 1998 — 3 editions
    Not in Library

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  • Cover of: Electronics manufacturing: with lead-free, halogen-free, and conductive-adhesive materials

    First published in 2002 — 3 editions
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  • Cover of: Electrical Conductive Adhesives with Nanotechnologies

    First published in 2008 — 3 editions
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  • Cover of: Micro- and Opto-Electronic Materials and Structures : Physics, Mechanics, Design, Reliability, Packaging: Volume I Materials Physics - Materials Mechanics. Volume II Physical Design - Reliability and Packaging

    First published in 2007 — 2 editions
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Subjects

2866, 3148, 3460, 4482, 4927, Design and construction, Electronic apparatus and appliances, Electronic packaging, Electronics, materials, Environmental protection, General, Green electronics, Green products, Manufactures, Materials science, Nanotechnology & mems, Professional, career & trade -> electronics -> circuits, Professional, career & trade -> electronics -> general, Sct24027, Sct24068, Scz00000, Scz12000, Scz14000, Suco11647, Trades & technology -> industrial technology -> materials science

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ID Numbers

  • OLID: OL2634269A

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History

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April 29, 2008 Created by an anonymous user initial import